Reliability - Environment

Reliability - Environment

Reliability analysis is based on quantitative data as the basis of product quality, through the experimental simulation, the product in a given time, specific use of environmental conditions, the implementation of specific specifications, the probability of successful completion of work objectives, to quantitative data as the basis for product quality assurance. Among them, environmental testing is a common analysis item in reliability analysis.

Environmental reliability testing is a test performed to ensure that the functional reliability of a product is maintained during the specified life period, under all circumstances in which it is intended to be used, transported or stored. The specific test method is to expose the product to natural or artificial environmental conditions, to evaluate the performance of the product under the environmental conditions of actual use, transportation and storage, and to analyze the impact of environmental factors and their mechanism of action.

Sembcorp's Nanoreliability Analysis laboratory mainly evaluates IC reliability by increasing temperature, humidity, bias, analog IO and other conditions, and selecting conditions to accelerate aging according to IC design requirements. The main test methods are as follows:

TC temperature cycle test

Experimental standard: JESD22-A104

Objective: To accelerate the effect of temperature change on the sample

Test procedure: The sample is placed in a test chamber, which cycles between specified temperatures and is held at each temperature for at least ten minutes. The temperature extremes depend on the conditions selected in the test method. The total stress corresponds to the number of cycles completed at the specified temperature.

capacity of equipment

Temperature Range	-70℃—+180℃
Temperature Change Rate	15℃/min linear
Internal Volume	160L
Internal Dimension	W800*H500 * D400mm
External Dimension	W1000 * H1808 * D1915mm
Quantity of sample	25 / 3lot
Time/pass	700 cycles / 0 Fail 2300 cycles / 0 Fail

BLT high temperature bias test

Experimental standard: JESD22-A108

Objective: The influence of high temperature bias on samples

Test process: Put the sample into the experimental chamber, set the specified voltage and current limit value in power supply, try run at room temperature, observe whether the limited current occurs in power supply, measure whether the input chip terminal voltage meets the expectation, record the current value at room temperature, and set the specified temperature in chamber. When the temperature is stable at the set value, power on at high temperature and record the high temperature current value

Equipment capacity:

Temperature Range	+20℃—+300℃
Internal Volume	448L
Internal Dimension	W800*H800 * D700mm
External Dimension	W1450 * H1215 * D980mm
Quantity of sample	25 / 3lot
Time/pass	Case Temperature 125℃ ,1000hrs/ 0 Fail

HAST highly accelerated stress test

Experimental standard: JESD22-A110/A118 (EHS-431ML, EHS-222MD)

Objective: HAST provides constant multiple stress conditions, including temperature, humidity, pressure, and bias. Carried out to assess the reliability of non-enclosed packaged equipment operating in humid environments. Multiple stress conditions can accelerate the infiltration of moisture through the encapsulation mold compound or along the interface between the external protective material and the metal conductor passing through the encapsulation. When water reaches the surface of the bare piece, the applied potential sets up an electrolytic condition that corrodes the aluminum conductor and affects the DC parameters of the device. Contaminants present on the chip surface, such as chlorine, can greatly accelerate the corrosion process. In addition, too much phosphorus in the passivation layer can also react under these conditions.

Device 1 and device 2

Equipment capacity:

Quantity of sample	25 / 3lot
Time/pass	130℃，85%RH ,96hrs/ 0 Fail
	110℃，85%RH ,264hrs/ 0 Fail

Device 1

Temperature Range	-105℃—+142.9℃
Humidity Range	75%RH—100%RH
Pressure Range	0.02—0.196MPa
Internal Volume	51L
Internal Dimension	W355*H355 * D426mm
External Dimension	W860 * H1796 * D1000mm

Device 2

Temperature Range	-105℃—+142.9℃
Humidity Range	75%RH—100%RH
Pressure Range	0.02—0.392MPa
Internal Volume	180L
Internal Dimension	W569*H560 * D760mm
External Dimension	W800 * H1575 * D1460mm

THB temperature and humidity cycle test

Experimental standard: JESD22-A101

Objective: The influence of temperature and humidity change on the sample

Experimental process: Put the sample into the experimental chamber, set the specified voltage and current limit value in power supply, try run at room temperature, observe whether the limited current occurs in power supply, measure whether the input chip terminal voltage meets the expectation, record the current value at room temperature, and set the specified temperature in chamber. When the temperature is stable at the set value, power on at high temperature and record the high temperature current value

Equipment capacity:

Temperature Range	-40℃—+180℃
Humidity Range	10%RH—98%RH
Temperature Conversion Rate	3℃/min
Internal Volume	784L
Internal Dimension	W1000*H980 * D800mm
External Dimension	W1200 * H1840 * D1625mm
Quantity of sample	25 / 3lot
Time/pass	85℃，85%RH ,1000hrs/ 0 Fail
	Procedure temperature and humidity cycle, there has no humidity when temperature over 100℃

TSA&TSB temperature shock test

Experimental standard: JESD22-A106

Objective: To accelerate the effect of temperature change on the sample

Test process: The sample is put into the test chamber, and the specified temperature is set inside the chamber. Before heating up, it is confirmed that the sample has been fixed on the mold, which has prevented damage due to the sample falling into the chamber during the experiment.

Equipment capacity:

	TSA	TSB
Temperature Range	-70℃—+200℃	-65℃—+200℃
Temperature Change Rate	≤5min	＜20S
Internal Volume	70L	4.5L
Internal Dimension	W410*H460 * D3700mm	W150*H150 * D200mm
External Dimension	W1310 * H1900 * D1770mm	W1200 * H1785 * D1320mm